3-6” Raw Silicon Wafer
We have advanced silicon chip processing and quality testing equipment and processes such as multi-wire cutting machines, double-sided grinding machines, Silicon chip chamfering machines, fully automatic ultrasonic cleaning machines and non-contact silicon chip automatic sorting machines. According to the requirements of the ISO 9001:2015 quality management system and the ISO 140001:2015 environmental management system, we will strictly adhere to the product quality clearance and provide semiconductor chip manufacturers with high-quality single-crystal silicon wafers of various specifications.
|
Specifications |
ResistivityΩ·CM |
Thicknessμm |
Crystal Orientation |
Lifeμs |
External Diametermm |
Dopant |
Form |
Radial uniformitty of resistivity |
|||
|
Polishing rod |
Positioning stick |
Chamfering |
Flattingiece |
||||||||
|
3” |
0.001-55 |
200-350 |
<111> |
＞100 |
76.2±0.3 |
Phosphorus/Boron |
√ |
√ |
√ |
√ |
≤20% |
|
4” |
0.001-55 |
200-350 |
<111> |
＞100 |
101.6±0.3 |
Phosphorus/Boron |
√ |
√ |
√ |
√ |
≤20% |
|
5” |
0.001-55 |
200-350 |
<111> |
＞100 |
125±0.3 |
Phosphorus/Boron |
√ |
√ |
√ |
√ |
≤20% |
